Positions:
Head, Department of Materials Engineering, Azrieli College of Engineering, Jerusalem, Israel
Member of the Academic Council, Azrieli College of Engineering
Member, Admittance committee, Azrieli College of Engineering
Research interests:
(1) Electrochemical Bio-sensors; (2) Plant Based Electrochemical Bio-sensing; (3) Electrochemical Deposition of Nano structures; (4) Characterization of Surface Properties of CMOS Compatible Self Assembled Monolayers (SAM) on low K dielectrics; (5) Flexible Printed Electrodes for Bio Sensors; (6) Polymeric Micro Technologies for MEMS and Biochip Applications
Representative publications:
- Kadan- Jamal , R. Ofek Almog , J. Zhou, T. Dotan, Y. Sverdlov, R. Dagan, and Y. Shacham-Diamand “Characterization of Silane Based Ultra-Thin Barrier Deposited at Elevated Temperature” Submitted to “Microelectronic Engineering “ (Submitted August 2020)
- Golan, H. Shalom, I. Kaplan-Ashiri, S. R. Cohen, Y. Feldman, I. Pinkas, R. Ofek Almog, A. Zak , R. Tenne, “Poly(L-lactic acid) reinforced with hydroxyapatite and tungsten disulfide nanotubes”, Polymers 2021, 13(21), 3851; https://doi.org/10.3390/polym13213851
- Ofek Almog, R. Pandey, Y. Sverdlov, Y. Shacham-Diamand “Gold Nanoparticle Metallization of Flexible Conducting Polymer Electrode”, ECS Trans. 66(19), (2015) pp. 1-11
- Ofek Almog Y. Sverdlov, Y. Shacham-Diamand et.al, “Integrated polypyrrole electrodes for bio-chips and MEMS applications," Journal of Atomic, Molecular, and Optical Physics, Volume 2012 (2012), Article ID 850482, doi:10.1155/2012/850482
- Ofek Almog, Y. Sverdlov, N. Fishelson and Y. Shacham-Diamand, “Electrochemical Micro Technologies for Polymeric MEMS and Biochip Applications”, ECS Trans. 25 (16), (2010) pp. 17-21
- Shacham-Diamand, S. Krylov, T. Shmilovich, R. Ofek Almog, N. Fishelson, Y. Sverdlov, I. Torchinsky, G. Rosenman, A. Inberg and O. Berkh, "Metallization Technologies and Strategies for Plastic Based Biochips, Sensors and Actuators for Healthcare and Medical Applications”, ECS Trans. 23 (1), (2009) pp. 243 – 254.
- Ofek Almog, Y. Sverdlov, I.Goldfarb and Y. Shacham-Diamand, "CoWBP Capping Barrier Layer for sub 90 nm Cu Interconnects", Microelectron Eng. ,Vol. 84, (11), (2007) ,pp. 2450-2454.
